High Conductivity

features

High Conductivity

Typical Product:AS-4100、AS-4200

This is an anisotropic paste for bonding to substrate electrodes such as FPC with excellent workability and high connecting stability.

 

AS-4100:
・Due to metal bonding by solder melting,  the connection resistance is lower than ACF,  and alteration of temporal pressure bonding  force is not much.
・Comparing with connector type, it can   correspond to fine pitch to achieve low hieight.

AS-4200:By improving the shape of the conductive particles, high connection reliability is possible.

 

 Product

 AS-4100<※1>

 AS-4200

 Filler Type

 Solder Filler

 Ni-Coated Resin Filler

 Viscosity

 71,000mPa・s

 54,000mPa・s

 Pre-Gel Condition 

 130℃×10sec

 130℃×10sec

 Cure Condition

 180℃×15sec

 180℃×15sec

 Tg

 126℃

 126℃

 CTE

 82 / 192 ppm

 72 ppm

 Modulus

 2.6 GPa

 2.5 GPa

 Tensile Shear Strength (FR4)

 -

 24 MPa

 Application Example

 Adhesion of camera module and FPC

 Module :PCB/FPC

※1 The patent is authorized by Panasonic Factory Solutions.


 

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