Heat Curable Type

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PRODUCTS
PRODUCTS Heat Curable Type
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Heat-curable adhesive is also called epoxy adhesive that activates and cures by applying the specified heat.
Strong chemical resistance and excellent adhesion are also the typical features.

Low-Temp. Cured Type

 Product No.  Viscosity(mPa･s)  Tg(℃)  Curing Condition  Feature  Application
  AS-3014  1100  38  80℃×15min  Low-Temp. Fast Curing  Adhesion of Diaphragm / Magnet
  AS-301403  9500  32  80℃×15min  Low-Temp. Fast Curing  Adhesion of Micro Speaker Magnet
  AS-399618  1500  36  80℃×30min  Light Shielding  Adhesion of Plastic Lens
  AS-301905  13000  95  90℃×60min  Shock Resistance、
 Flow Suppress		  Adhesion of Linear Vibrator Coil
  AS-3030  3000  38  80℃×60min  Shock and Moisture Resistance  Adhesion of Camera Module Holder

High Heat Resistance Type

 Product No.  Viscosity(mPa･s)  Tg(℃)  Curing Condition  Feature  Application
  AS-300213  15000  104  100℃×30min  Excellent PA Adhesion  Adhesion of Camera Module / Frame
  AS-3607  18000  75  120℃×30min  Flow Suppress  Board of Sensor、Cap
  AS-3711  15000  145  150℃×1min  Fast Curing  Adhesion of Heat Resistance Parts

Underfill for Secondary Mounting

 Product No.  Viscosity(mPa･s)  Tg(℃)  CTE  Curing Condition  Feature
  AS-3905  300  120  76 / 202  125℃×15min  Low Viscosity、High Permeability
  AS-3028  4000  120  36 / 156  120℃×15min  High Reliability、Low CTE

For Sealing

 Product No.  Viscosity(mPa･s)  Tg(℃) CTE  Feature  Application
  AS-300202  4500  104  -  High Adhesion  Potting、Sealing
  AS-3027B  65000  120  31 / 140  Low Shrinkage  Sealing of Connector Pin
  AS-301421  8000  50  78 / 212  Heat Resistance、High Adhesion  Sealing of Connector Pin
  AS-380101  55000  145  14 / 56  Low CTE  Sealing of Communication Module IC.

UV+ Thermal Curing

 Product No.  Viscosity(mPa･s)  Tg(℃)  Hardness  Feature  Application Example
  AS-340102  1000  86  D-75  High Viscosity UV Fast Curing  Holder Adhesion of Camera Module

Anisotropic Conductive Paste

 Product No.  Filler type  Viscosity(mPa･s)  Pre-Gelation Condition  Curing Condition  Application Example
  AS-4100  Solder Particle  71000  130℃×10sec  180℃×15sec  Adhesion of Camera Module & FPC
  AS-4200  Ni-Coated Resin  54000  130℃×15sec  180℃×15sec  Various Module、Adhesion of PCB・FPC

For Impregnation

 Product No.  Viscosity(mPa･s)  Curing Condition  Features  Remarks  Application Example
  AS-6701  45  120℃×30min  Heat-Curing Acrylic、
 Impact Resistance		  -  Motor Core Laminated Adhesion
  AS-6704  100  120℃×30min  Heat-Curing Acrylic、
 Heat Resistance		  -  Motor Core Laminated Adhesion
PRODUCTS APPLICATIONS FEATURES

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