FEATURES

Undertfill

Typical Products：AS-3905, AS-3028

By applying underfill in CSP、WLP、the solder ball between package and substrate can be protected the damage such as vibration, bending or dropping impact, and improve the reliability via vibration, bending or dropping impact to improve the reliability.

Product	AS-3905	AS-3028
Feature	High permeability	High Reliability
Viscosity	300mPa・s	6,000mPa・s
Curing Condition	125℃ x 15min　150℃ x 10min	120℃ x 15min　150℃ x 8min
Integrated Amount of Light	1000mJ/cm2	1000mJ/cm2
Tg	120℃	120℃
CTE	76 / 202ppm	36 / 156ppm
Modulus	2.7 GPa	4.3 GPa
Tensil Shear Strength	10MPa	>12MPa

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