Undertfill

features

Undertfill

 

Typical Products:AS-3905, AS-3028

By applying underfill in CSP、WLP、the solder ball between package and substrate can be protected the damage such as vibration, bending or dropping impact, and improve the reliability via vibration, bending or dropping impact to improve the reliability.

 

 Product

 AS-3905

 AS-3028

 Feature

 High permeability

 High Reliability

 Viscosity

 300mPa・s

 6,000mPa・s

 Curing Condition

 125℃ x 15min 150℃ x 10min

 120℃ x 15min 150℃ x 8min

 Integrated Amount of Light

 1000mJ/cm2

 1000mJ/cm2

 Tg

 120℃

 120℃

 CTE

 76 / 202ppm

 36 / 156ppm

 Modulus

 2.7 GPa

 4.3 GPa

 Tensil Shear Strength

 10MPa

 >12MPa

 

 

PRODUCTS APPLICATIONS FEATURES

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