Website Design Copyright 2025 © Asec Co., Ltd
All Rights Reserved. 網頁設計 by 覺醒設計
By applying underfill in CSP、WLP、the solder ball between package and substrate can be protected the damage such as vibration, bending or dropping impact, and improve the reliability via vibration, bending or dropping impact to improve the reliability.
| Product | AS-3905 | AS-3028 |
|---|---|---|
| Feature | High permeability | High Reliability |
| Viscosity | 300mPa・s | 6,000mPa・s |
| Curing Condition | 125℃ x 15min 150℃ x 10min | 120℃ x 15min 150℃ x 8min |
| Integrated Amount of Light | 1000mJ/cm2 | 1000mJ/cm2 |
| Tg | 120℃ | 120℃ |
| CTE | 76 / 202ppm | 36 / 156ppm |
| Modulus | 2.7 GPa | 4.3 GPa |
| Tensil Shear Strength | 10MPa | >12MPa |
In compliance with EU personal data protection laws, we are committed to protecting and providing you with control over your personal data. By clicking "Accept All", you allow us to place cookies to enhance your experience on this site, help us analyze site performance and usage, and enable us to deliver relevant marketing content. You can manage your cookie settings below. By clicking "Accept all" you accept the current settings. For more information, please visit the Privacy Statement.
This website uses cookies
In compliance with EU personal data protection laws, we are committed to protecting your personal data and providing you with control over it. By clicking "Agree", you allow us to place cookies to improve your experience on this site, help us analyze site performance and usage, and allow us to deliver relevant marketing content.
By clicking "Only necessary" you allow us to place only necessary cookies. The website cannot function without these cookies and you cannot switch them off on your system. These cookies are typically set only in response to an action you perform (i.e. a service request), such as setting privacy preferences, logging in, or filling in a form. You can set your browser to block or prompt you for these cookies, but this may prevent some site features from working.
